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  1. Maxhuni, Alban; Hernadez-Leal, Pablo; Morales, Eduardo F.; Sucar, Enrique; Osmani, Venet; Mayora, Oscar,
    Unobtrusive Stress Assessment Using Smartphones,
    in «IEEE TRANSACTIONS ON MOBILE COMPUTING»,
    vol. 20,
    n. 6,
    2021
    , pp. 2313 -
    2325
  2. Barlacchi, Gianni; Lepri, Bruno; Moschitti, Alessandro,
    Land Use Classification with Point of Interests and Structural Patterns,
    in «IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING»,
    vol. 33,
    n. 9,
    2021
    , pp. 3258 -
    3269
  3. Mancini, Massimiliano; Porzi, Lorenzo; Rota Bulò, Samuel; Caputo, Barbara; Ricci, Elisa,
    Inferring Latent Domains for Unsupervised Deep Domain Adaptation,
    in «IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE»,
    vol. 43,
    n. 2,
    2021
    , pp. 485 -
    498
  4. Zhang, X.; Centenaro, M.; Tomasin, S.; Benvenuto, N.; Luo, X.; Yang, S.,
    A study on CSI feedback schemes exploiting feedforward information in FDD cellular systems,
    in «TRANSACTIONS ON EMERGING TELECOMMUNICATIONS TECHNOLOGIES»,
    vol. 32,
    n. 1,
    2021
  5. Mazzara, Manuel; Dragoni, Nicola; Bucchiarone, Antonio; Giaretta, Alberto; Larsen, Stephan T.; Dustdar, Schahram,
    Microservices: Migration of a Mission Critical System,
    in «IEEE TRANSACTIONS ON SERVICES COMPUTING»,
    vol. 14,
    n. 5,
    2021
    , pp. 1464 -
    1477
  6. Iannacci, J.,
    Coupled electromechanical and electromagnetic simulation of radio frequency microelectromechanical-systems (RF-MEMS) based on compact models approach,
    in «MICROSYSTEM TECHNOLOGIES»,
    vol. 27,
    n. 1,
    2021
    , pp. 59 -
    67
  7. Iannacci, J.,
    Study of the Radio Frequency (RF) performance of a Wafer-Level Package (WLP) with Through Silicon Vias (TSVs) for the integration of RF-MEMS and micromachined waveguides in the context of 5G and Internet of Things (IoT) applications. Part 2: parameteri...,
    in «MICROSYSTEM TECHNOLOGIES»,
    vol. 27,
    n. 1,
    2021
    , pp. 223 -
    234
  8. Iannacci, J.,
    Investigation of the impact on the radio frequency (RF) behaviour of electrically conductive adhesives (ECAs) used in wafer-level packaging (WLP) of RF-MEMS,
    in «MICROSYSTEM TECHNOLOGIES»,
    vol. 27,
    n. 1,
    2021
    , pp. 201 -
    209
  9. Iannacci, J.,
    An active heat-based restoring mechanism for high reliability RF-MEMS switches,
    in «MICROSYSTEM TECHNOLOGIES»,
    vol. 27,
    n. 1,
    2021
    , pp. 183 -
    187
  10. Saha, Sudipan; Mou, Lichao; Zhu, Xiao Xiang; Bovolo, Francesca; Bruzzone, Lorenzo,
    Semisupervised Change Detection Using Graph Convolutional Network,
    in «IEEE GEOSCIENCE AND REMOTE SENSING LETTERS»,
    2021
    , pp. 607 -
    611

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